push-pull testing machine portfolio, where measurements are made on a microscopic scale. We engineer our bond testers for the specific challenges of the electronics and semiconductor industries, where even the slightest inaccuracy can lead to false passes or failures. Our commitment begins with the core architecture of the machine—a highly rigid, vibration-dampened frame that ensures all measured force is applied directly to the bond, not lost to machine flex. We integrate industry-leading, high-resolution load cells and precision XYZ stages to provide exceptional accuracy and repeatability. For clients like Samsung and LG, who produce millions of devices where every connection counts, this level of precision is non-negotiable. A WBE push-pull testing machine