Custom Tooling for Your Push-Pull Testing Machine Application.

The reliability of LEDs and other optoelectronic devices is heavily dependent on the mechanical and thermal integrity of their internal structure. A push-pull testing machine is a key tool for quality assurance in this industry. For high-power LEDs, the quality of the die attach is critical for effective heat dissipation; poor adhesion can cause the device to overheat and fail prematurely. Die shear testing is used to verify the strength and voiding of this thermal interface. Wire bonds in LEDs are also subject to stress from thermal cycling, so wire bond pull testing is essential to ensure they are robust. Furthermore, specialized tests like lens shear testing can be performed on a push-pull testing machine to ensure the optical element is securely attached to the package. By validating these critical assembly steps, manufacturers can ensure the long-term performance and reliability of their lighting and optoelectronic products.

When using a push-pull testing machine, engineers can choose between two fundamental methods: destructive and non-destructive testing. Destructive testing is the most common method used for process control. It involves testing a sample of components to failure to determine the absolute maximum strength of the bonds. This provides valuable statistical data about the health and capability of the manufacturing process. Non-destructive testing, on the other hand, is used for 100% screening of very high-reliability devices, such as those used in military or space applications. In this test, the machine applies a proof force—a force that is significant but well below the expected breaking point—to every single wire bond. If a bond survives, it is certified as meeting a minimum strength requirement. WBE's push-pull testing machine can be precisely programmed to perform both types of tests accurately.

Selecting the right push-pull testing machine requires a careful evaluation of your specific applications. First, identify the types of tests you need (e.g., wire pull, die shear, ball shear). This will determine the required test modules or heads. Second, determine the force ranges needed for each test. A machine used for fine gold wire will need a very sensitive low-force sensor, while a machine for large die shear will need a high-force capability. Look for a system with interchangeable load cell cartridges for maximum flexibility. Third, consider the level of automation and the required throughput. Manual or motorized stages may be sufficient for a lab, while a fully automated system might be needed for high-volume production. Finally, evaluate the software capabilities, ensuring it can perform the necessary analysis and generate reports that meet your quality standards. Consulting with an expert at WBE can help you navigate these options to configure the perfect push-pull testing machine.

As integrated circuit (IC) packaging evolves towards 3D-ICs, stacked dies, and System-in-Package (SiP) designs, the challenges for testing also increase. WBE's advanced push-pull testing machine solutions are engineered to meet these challenges. For stacked die applications, we offer specialized deep-access tooling to perform shear tests on the lower dies without interference. For fine-pitch and high-density wire bonding, our high-magnification optics and precise motion control allow for accurate testing of even the most challenging geometries. Our software is designed to handle complex test routines, allowing for different tests to be performed on a single device in one program. By continuously innovating and working with industry leaders, WBE ensures that our push-pull testing machine capabilities keep pace with the advancements in semiconductor technology, providing our clients with the tools they need to validate their most complex and valuable products.