Ensure MIL-STD-883 Compliance with Accurate Bond Testing.

The data from a push-pull testing machine provides much more than just a peak force number; proper interpretation is key to process improvement. The numerical force value tells you the strength, but the failure mode tells you why it failed. For example, in a wire bond pull test, a "wire break" in the middle indicates a good, strong bond, while a "ball lift" (the entire bond lifts off the pad) points to a problem with the bonding surface or parameters. The software on a WBE machine helps operators log these JEDEC-standard failure modes. Analyzing the distribution of these modes, along with statistical data like the mean force and standard deviation (Cpk), gives engineers a complete picture of their process health. A high average strength with a low standard deviation and a desirable failure mode distribution is the hallmark of a stable, high-quality manufacturing process, all revealed by the data from a push-pull testing machine.

A push-pull testing machine, known in the industry as a bond tester, is a specialized instrument used to measure the mechanical strength of the tiny connections inside electronic and semiconductor devices. Its primary purpose is to perform quality control by applying precise push (shear) or pull (tensile) forces to these connections until they fail, thus determining their strength. Key applications include wire bond pull testing, where it hooks and pulls a wire to ensure it is properly attached; ball shear testing, where it pushes on a solder ball to test its adhesion to a circuit board pad; and die shear testing, which measures the strength of the adhesive holding a silicon chip onto its package substrate. This data is critical for manufacturers to ensure their products are robust enough to withstand the stresses of assembly and everyday use, preventing field failures and ensuring long-term reliability.

As integrated circuit (IC) packaging evolves towards 3D-ICs, stacked dies, and System-in-Package (SiP) designs, the challenges for testing also increase. WBE's advanced push-pull testing machine solutions are engineered to meet these challenges. For stacked die applications, we offer specialized deep-access tooling to perform shear tests on the lower dies without interference. For fine-pitch and high-density wire bonding, our high-magnification optics and precise motion control allow for accurate testing of even the most challenging geometries. Our software is designed to handle complex test routines, allowing for different tests to be performed on a single device in one program. By continuously innovating and working with industry leaders, WBE ensures that our push-pull testing machine capabilities keep pace with the advancements in semiconductor technology, providing our clients with the tools they need to validate their most complex and valuable products.

MIL-STD-883 is a U.S. military standard that establishes uniform methods for testing microelectronic devices. It is the gold standard for ensuring the reliability of components used in demanding military, aerospace, and defense applications. Several of its test methods apply directly to the use of a push-pull testing machine. For example, Method 2011 specifies the procedures for wire bond pull testing, outlining the required forces, test conditions, and failure criteria for different wire types and diameters. Method 2019 covers die shear testing. Adherence to these standards is mandatory for suppliers in the defense industry. A high-quality push-pull testing machine from WBE is designed to meet and exceed the accuracy and performance requirements of MIL-STD-883, with software that can be configured to execute these test methods precisely and generate compliant reports, ensuring your components are qualified for high-reliability applications.