push-pull testing machine, also known as a bond tester, is a highly specialized instrument designed to measure the strength and integrity of these critical interconnects. By applying precise tensile (pull) and shear (push) forces to wire bonds, solder balls, and die attachments, this machine provides the essential quantitative data needed to ensure product quality and longevity. As device complexity increases and component sizes shrink, the role of a high-precision push-pull testing machine