New Energy
Due to the complex application environment of products, the new energy industry relies heavily on reliability testing equipment for testing. For example, new energy vehicles need to cope with extreme temperature, humidity, vibration and salt spray, and photovoltaic equipment needs to be resistant to wind and sand and weather, all of which need to be simulated and verified. The equipment can expose design defects in advance, such as poor battery life at low temperature, short circuit at high temperature, etc., to help enterprises optimize design and process and ensure the stable operation of products. At the same time, it can extend the life of the product, such as the durability of offshore wind power equipment after being optimized by anti-corrosion testing, and reduce maintenance costs. In addition, it can also meet industry standards and ensure product safety and compliance, which is the key support for the high-quality development of the industry.
• JESD22 (A series of mechanical and environmental test methods)
• JESD47 (Stress Test Driven Qualification)
• JESD94 (Application Reliability Assessment)
• JESD22-A114 (ESD Human Body Model HBM test)
• AEC-Q100 (Stress test qualification based on integrated circuits)
• MIL-STD-883 (Microelectronics device test method standard)
• MIL-PRT-38534 (General Specification for Integrated Circuit Manufacturing)
• ISO 26262 (Functional safety of road vehicles)
• IEC 61508 (Functional safety of electrical/electronic/programmable electronic safety- related systems)
• ESD SPM5.1 (ESD Association Standard: Electrostatic Discharge Sensitivity Test)
• Temperature testing: Supports testing from -70°C to 100°C, including high and low temperature, alternating humidity and heat, and constant humidity and heat tests to verify product temperature resistance.
• Humidity testing: Simulates different temperature and humidity environments, enabling long-term endurance testing (e.g., 85°C/85% RH for 1000 hours) to evaluate material moisture resistance.
• Altitude testing: Simulates low-pressure plateau environments to test the electrical performance and adaptability of semiconductors in low-pressure and low-temperature conditions.
• Vibration testing: Simulates transportation or operational vibration to verify product structural stability and functional reliability.
• Stress testing: Includes workload and long-term environmental stress testing to identify potential product defects and provide a basis for improvement.
High And Low Temperature Test Chamber
High and low temperature test chambers are key equipment for reliability testing in the semiconductor industry. They are mainly used to simulate extreme temperature environments and perform temperature cycling, high temperature and high humidity, low temperature storage and other tests on chips to evaluate their performance, stability and life under different climatic conditions.
Feature
- Electronic expansion valve control technology + PID control, maximum energy saving of 45% (long-term operation for more than 1 year without stopping);
- Scientific air duct design, fast temperature stability, better control of uniformity;
- Self-developed control system, with refrigeration PID control and high-speed processing capabilities, automatic load adjustment, stable performance;
- Customized production can meet customized requirements such as various specifications, refrigeration methods, water supply and language selection;