Semiconductor
The semiconductor industry has an urgent demand for reliability testing equipment because of its high product integration and demanding application scenarios. In automotive electronics, aerospace equipment and other scenarios, chips need to withstand extreme temperatures (-75°C~ 125°C), humidity, vibration and other environments
• JESD22 (A series of mechanical and environmental test methods)
• JESD47 (Stress Test Driven Qualification)
• JESD94 (Application Reliability Assessment)
• JESD22-A114 (ESD Human Body Model HBM test)
• AEC-Q100 (Stress test qualification based on integrated circuits)
• MIL-STD-883 (Microelectronics device test method standard)
• MIL-PRT-38534 (General Specification for Integrated Circuit Manufacturing)
• ISO 26262 (Functional safety of road vehicles)
• IEC 61508 (Functional safety of electrical/electronic/programmable electronic safety- related systems)
• ESD SPM5.1 (ESD Association Standard: Electrostatic Discharge Sensitivity Test)
• Temperature testing: Supports testing from -70°C to 100°C, including high and low temperature, alternating humidity and heat, and constant humidity and heat tests to verify product temperature resistance.
• Humidity testing: Simulates different temperature and humidity environments, enabling long-term endurance testing (e.g., 85°C/85% RH for 1000 hours) to evaluate material moisture resistance.
• Salt spray testing: Simulates corrosive environments to test the corrosion resistance of products
• Dust testing: Simulates high dust levels to verify product sealing integrity and protective reliability.
• Rain exposure testing: Simulates heavy rainfall to evaluate product waterproofing and operational stability in humid conditions.
• Altitude testing: Simulates low-pressure plateau environments to test the electrical performance and adaptability of semiconductors in low-pressure and low-temperature conditions.
• Vibration testing: Simulates transportation or operational vibration to verify product structural stability and functional reliability.
• Stress testing: Includes workload and long-term environmental stress testing to identify potential product defects and provide a basis for improvement.
High And Low Temperature Test Chamber
High and low temperature test chambers are key equipment for reliability testing in the semiconductor industry. They are mainly used to simulate extreme temperature environments and perform temperature cycling, high temperature and high humidity, low temperature storage and other tests on chips to evaluate their performance, stability and life under different climatic conditions.
Feature
- Electronic expansion valve control technology + PID control, maximum energy saving of 45% (long-term operation for more than 1 year without stopping);
- Scientific air duct design, fast temperature stability, better control of uniformity;
- Self-developed control system, with refrigeration PID control and high-speed processing capabilities, automatic load adjustment, stable performance;
- Customized production can meet customized requirements such as various specifications, refrigeration methods, water supply and language selection;