The three-slot hot and cold shock test chamber is used to test the material structure or composite material, and the degree to which it can endure the continuous environment of extremely high temperature and extremely low temperature in an instant, so as to test the chemical changes or physical damage caused by thermal expansion and contraction in the shortest time.
Application fields:
Semiconductor chips, scientific research institutions, quality inspection, new energy, optoelectronic communications, aerospace military industry, automotive industry, LCD display, medical and other technology industries.
Test standards:
GJB 150.3, GJB 150.4, GJB150.5, GB/T 2423.1, GB/T 2423.2, JESD22-A106B, MIL-STD-810G, MIL-STD-202G
Product features:
1.3-box impact method, temperature storage temperature impact method, temperature conversion is switched by opening/closing the damper.
2. The sample is stationary, without mechanical shock, which is convenient for power-on, external cable and other tests.
3. Temperature shock mode: high temperature → normal temperature → low temperature; low temperature → normal temperature → high temperature; low temperature → high temperature, room temperature exposure test can be performed. Two-box (basket) and three-box (energy storage) shock modes can be customized according to sample requirements.
4. Meet reliability tests such as temperature cycle TC, hot and cold shock, thermal stress screening, performance testing, etc.
5. Adopt electronic expansion valve technology, high efficiency and energy saving> 45%.