The rapid temperature change and humidity test chamber is used to detect the performance of products under rapid temperature changes and extreme temperature conditions. It simulates the impact of different climate conditions on products to examine the failure caused by the thermal mechanical properties of products, especially for environmental stress screening (ESS) tests of electronic and electrical products.
Application areas:
Semiconductor chips, scientific research institutions, quality inspection, new energy, optoelectronic communications, aerospace and military industry, automobile industry, LCD display, medical and other technology industries.
Test standards:
GB/T 2423.1 Low Temperature Test Method；GJB 150.3 High Temperature Test Method,；GB/T 2423.2 High Temperature Test Method,；GJB 150.4 Low Temperature Test,；GB/T2423.34 Humidity Cycle Test Method,；GJB 150.9 Humidity Test Method, IEC60068-2 Temperature and Humidity Test Method； MIL-STD-202G-103B Humidity Test
Product features:
1. The product meets both linear and nonlinear temperature ramping requirements.
2. It meets temperature ramp rate requirements of 5°C/min to 30°C/min.
3. Optional features include liquid nitrogen, moist heat, and anti-condensation.
4. Utilizing electronic expansion valve technology and an innovative control system, the product achieves energy savings exceeding 45%.
