Rapid Temperature Rising and Falling Test Chamber：It is used to detect the performance of products under rapid temperature changes and extreme temperature conditions. It simulates the impact of different climatic conditions on products to examine the failure caused by the thermomechanical properties of products, especially for the Environmental Stress Screening (ESS) test of electronic and electrical products.
This test measures product performance under rapid temperature changes and extreme temperature conditions. It is an effective method for identifying and eliminating premature failures caused by process or components in products such as circuit boards and electronic components. Commonly used temperature ramp rates are 5°C/min, 10°C/min, 15°C/min, 20°C/min, and 25°C/min.
Application areas:
Semiconductor chips, scientific research institutions, quality inspection, new energy, optoelectronic communications, aerospace and military industry, automobile industry, LCD display, medical and other technology industries.
Test standards:
GB/T 2423.1 Low Temperature Test Method, GJB 150.3 High Temperature Test Method, GB/T 2423.2 High Temperature Test Method, GJB 150.4 Low Temperature Test, GB/T2423.34 Humidity Cycle Test Method, GJB 150.9 Humidity Test Method, IEC60068-2 Temperature and Humidity Test Method, MIL-STD-202G-103B Humidity Test
Product features:
1. Meets reliability tests including environmental stress ESS screening, temperature and humidity testing, temperature cycling, high and low temperature storage, and weathering testing.
2. Meets both linear temperature change and average temperature change testing.
3. Optional features include liquid nitrogen, wet heat, and anti-condensation.
4. Utilizing electronic expansion valve technology and an innovative control system, the product offers energy savings exceeding 45%.
5. Fast temperature ramp rate: -55°C to +155°C in 10 minutes (20°C/min).
