Product Description:
The High and Low Temperature Shock Test Chamber (Split Type) features a split design, with the working and working chambers of the chamber system designed as independent modules, allowing customization. The test system is divided into a high-temperature tank (preheating zone) and a low-temperature tank (precooling zone). Rapid thermal shock testing is achieved by controlling the mobile basket (test sample placement area) to quickly move to the low-temperature or high-temperature tank.
Application :
Semiconductor chips, scientific research institutions, quality inspection, new energy, optoelectronic communications, aerospace and military industry, automobile industry, LCD display, medical and other technology industries.
Test Standards:
GJB 150.3、GJB 150.4、GJB150.5、GB/T 2423.1、GB/T 2423.2、JESD22-A106B、MIL-STD-810G、MIL-STD-202G
Product Features：
1. Split-body design allows for flexible movement, unrestricted by elevators or doorways.
2. Two-zone thermal shock test method: The test specimen moves up and down within the basket for thermal shock testing, minimizing heat load during thermal shock and shortening temperature recovery time.
3. Capable of 1000 continuous thermal shock cycles without defrosting, the ultra-low defrost frequency reduces waiting time and significantly improves testing efficiency.
4. Utilizing electronic expansion valve technology and an innovative control system, the product achieves energy savings exceeding 45% and extends its lifespan by over one-third.
5. The thermal shock mechanism moves within 5 seconds, complying with MIL, IEC, and JIS standards.
6. Highly specialized design allows customization of thermal shock test chambers with horizontal basket movement, three-chamber (ventilation), and immersion shock modes according to test requirements and sample size.
7. Compatible with temperature cycling, thermal shock testing, thermal stress testing, and performance testing.
