WBE High And Low Temperature Thermal Shock Chambers: This test measures the performance of test specimens subjected to sudden temperature changes in high and low temperatures. Widely used in products such as circuit boards and electronic components, it is an effective method for identifying and eliminating early failures caused by product processes and components.
Product Description:
It is used to test the degree to which material structures or composite materials can withstand continuous extremely high and low temperature environments in an instant, so as to test the chemical changes or physical damage caused by thermal expansion and contraction in the shortest possible time.
Application :
Semiconductor chips, scientific research institutions, quality inspection, new energy, optoelectronic communications, aerospace and military industry, automobile industry, LCD display, medical and other technology industries.
Test Standards:
GJB 150.3、GJB 150.4、GJB150.5、GB/T 2423.1、GB/T 2423.2、JESD22-A106B、MIL-STD-810G、MIL-STD-202G
Product Features：
1. Three-chamber shock method, a thermal storage shock method, with temperature conversion controlled by opening/closing the damper.
2. The specimen remains stationary, eliminating mechanical shock, making it convenient for testing with power applied and cables attached.
3. Temperature shock modes: high temperature → room temperature → low temperature; low temperature → room temperature → high temperature; low temperature → high temperature; room temperature exposure testing is also possible.
4. Customizable shock modes include two-chamber (basket), horizontal left-right movement, and immersion shock methods based on test requirements and sample size.
5. Suitable for reliability testing including temperature cycling, thermal shock, thermal stress screening, and performance testing.
6. Utilizes electronic expansion valve technology, achieving energy savings exceeding 45%.
