Grouped Temperature Shock Chamber: The split design allows for easy access through narrow test doors. The test system is divided into three sections: a high-temperature zone, a low-temperature zone, and a test zone. Utilizing a unique thermal insulation structure and heat and cold storage, the chamber utilizes hot and cold airflow switching to introduce heat into the test sample for thermal shock testing, without the test sample moving.
The grouped temperature shock test chamber features a split design, with the working and working chambers designed as independent modules, allowing customization. Independent slot airflow switching allows hot and cold air from the low- and high-temperature slots, as well as room temperature air, to be introduced into the test chambers. This allows for rapid transitions between low- and high-temperature environments, without the test specimens moving during the test.
Application fields:
Semiconductor chips, scientific research institutions, quality inspection, new energy, optoelectronic communications, aerospace military industry, automotive industry, LCD display, medical and other technology industries.
Test standards:
GJB 150.3, GJB 150.4, GJB150.5, GB/T 2423.1, GB/T 2423.2, JESD22-A106B, MIL-STD-810G, MIL-STD-202G
Product features:
1. Split-body design allows for flexible movement, unrestricted by elevators or doorways.
2. Three-chamber shock method, a thermal storage shock method, with temperature conversion controlled by opening/closing the damper.
3. The specimen remains stationary, eliminating mechanical shock, making it convenient for testing such as powering on and attaching cables.
4. Temperature shock modes: high temperature → room temperature → low temperature; low temperature → room temperature → high temperature; low temperature → high temperature; and room temperature exposure testing is also possible.
5. Customizable shock modes include two-chamber (basket), horizontally movable, and immersion shock methods based on test requirements and sample size.
6. Compatible with reliability tests such as temperature cycling, thermal shock, thermal stress screening, and performance testing.
7. Utilizes electronic expansion valve technology, achieving energy savings exceeding 45%.
