Push-pull force testing machine: widely used in microelectronics industry & semiconductor packaging for failure analysis and reliability testing. Such as wire welding strength test after microelectronic wire bonding, solder joint and substrate surface adhesion test, solder ball repetitive thrust fatigue test (inner lead pull test, micro solder joint thrust test, gold ball thrust test, chip shear force test, SMT welding component thrust test, BGA matrix overall thrust test).
Application field:
Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.
Product features:
1. Can perform all tension and shear (thrust) applications,
2. With bond wire strength tension test (WP), solder joint thrust test (BS), solder chip shear test (DS), down force test (DP), pull-out force (TP), etc.,
3. All-in-one automatic rotation replacement module, you can select 1 to 6 modules such as (thrust, shear, tension, pull-out, down force) and other modules individually and in combination,
4. Each sensor uses an independent anti-collision overload protection system to prevent accuracy deviation due to operational errors.
5. Tailor-made various precision fixtures and test tools (consumables).
