Semiconductor Push-Pull Testing Machine also known as a wire bond strength tester, shear force tester, or multifunctional push-pull tester, it is an important dynamic mechanical testing instrument for bonding, SMT, and microelectronics manufacturing. It is widely used for failure analysis and reliability testing of semiconductor packaging, optical communication device packaging, LED packaging, and military components.
Semiconductor Push-Pull Testing Machine also known as wire bond strength testers or shear force testers, are widely used in the microelectronics industry and semiconductor packaging for failure analysis and reliability testing. These tests include testing wire bond strength after microelectronic wire bonding, testing the adhesion between solder joints and substrate surfaces, and performing repetitive push fatigue testing of solder balls (including inner lead pull testing, micro solder joint push testing, gold ball push testing, chip shear force testing, SMT solder component push testing, and overall BGA matrix push testing).
Application field:
Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.
Test standards:
Product features:
1. Capable of performing all tensile and shear (push) applications.
2. Capable of testing bond wire strength pull (WP), solder joint push (BS), die shear (DS), downforce (DP), and pullout (TP).
3. An all-in-one, automatically rotating module exchange allows for selection of 1 to 6 modules (push, shear, tension, pullout, and downforce) individually or in combination.
4. Each sensor features an independent anti-collision and overload protection system to prevent accuracy deviations due to operational errors.
5. Customizable precision fixtures and test tools (consumables) are available.
