Wire Strength Push-pull Testing Machine also known as push-pull testers and bond strength testers, are widely used in the microelectronics industry and semiconductor packaging for failure analysis and reliability testing. They can perform bond wire tensile testing, solder joint push testing, and chip shear testing, switching between destructive and non-destructive testing. They are essential dynamic mechanical testing instruments for bonding, SMT, and microelectronics manufacturing.
Application field:
Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.
Test standards:
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Product features:
1. Ribbon Pull Test - A variety of hooks, jaws, and other load tools allow testing of various sample sizes and types.
2. Hot Bump/Needle Pull Test - Tests printed circuit board materials and low-profile solder bumps.
3. Copper Wire First Bump Pull, Wafer Shear, and Copper Pillar Bump Pull Test - Customized pull jaws enable tear testing of these critical connections.
4. Tension-Shear Fatigue Test - Fatigue analysis is becoming an increasingly important method for assessing solder joint reliability. Adjustable software and hardware enable fatigue testing in both tension and shear modes.
5. Passivation Layer Shear Test - Software and specialized load tools enable solder ball shear testing, regardless of passivation layer limitations.
