PCB Large Sample Push And Pull Testing Machine

PCB Large Sample Push And Pull Testing Machine also known as a large-size, large-stroke push-pull tester. It is widely used for failure analysis and reliability testing of semiconductor packaging, optical communication device packaging, LED packaging, and military components.

PCB Large Sample Push And Pull Testing Machine also known as a Large-Size, Large-Stroke Push-Pull Tester, features a large stroke, high precision, and automatic rotation and module change. It is suitable for testing large-size PCBs, mini panels, and large-scale specimens for push and pull forces, weld strength shear force testing, and pressure and pull-out force testing. It is an essential dynamic mechanical testing instrument for bonding, SMT, and microelectronics manufacturing processes.

Application field:

Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.

Test standards:


Product features:

1. The XYZ axis boasts an ultra-large travel range of 500*500*100mm, enabling full tensile and shear (push) testing of large PCBs, mini panels, and large specimens.
2. Capable of testing bond wire tensile (WP), solder joint push (BS), chip-to-substrate shear (DS), downforce (DP), and pullout (TP).
3. An all-in-one, automatic rotating module exchange allows for selection of 1 to 6 modules (push, shear, tension, pullout, and downforce) individually or in combination.
4. Each sensor features an independent anti-collision and overload protection system to prevent accuracy deviations due to operational errors.
5. Customizable precision fixtures and test tools (consumables) are available.