PCB Large Sample Push And Pull Testing Machine also known as a Large-Size, Large-Stroke Push-Pull Tester, features a large stroke, high precision, and automatic rotation and module change. It is suitable for testing large-size PCBs, mini panels, and large-scale specimens for push and pull forces, weld strength shear force testing, and pressure and pull-out force testing. It is an essential dynamic mechanical testing instrument for bonding, SMT, and microelectronics manufacturing processes.
Application field:
Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.
Test standards:
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Product features:
1. The XYZ axis boasts an ultra-large travel range of 500*500*100mm, enabling full tensile and shear (push) testing of large PCBs, mini panels, and large specimens.
2. Capable of testing bond wire tensile (WP), solder joint push (BS), chip-to-substrate shear (DS), downforce (DP), and pullout (TP).
3. An all-in-one, automatic rotating module exchange allows for selection of 1 to 6 modules (push, shear, tension, pullout, and downforce) individually or in combination.
4. Each sensor features an independent anti-collision and overload protection system to prevent accuracy deviations due to operational errors.
5. Customizable precision fixtures and test tools (consumables) are available.