LED Package Bonding Push-Pull testing machine this product features a large travel range, high precision, and multifunctionality, supporting both destructive and non-destructive testing. It is an indispensable dynamic mechanical testing instrument for LED packaging, bonding processes, SMT processes, and bonding processes.
LED Package Bonding Push-Pull testing machine is a versatile push-pull tester that can be used for (bond) tension and (push) shear force testing applications. It can also add the following test methods such as pressure and peel tear force to suit different test applications.
Application field:
Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.
Test standards:
Product features:
1. X- and Y-axis travel reaches up to 500mm, and 650mm can be customized upon request, accommodating large specimen testing.
2. Automatic rotary module changer automatically switches to the corresponding module within 5 seconds based on test needs, reducing the tediousness of manual module replacement and effectively minimizing the risk of damage. This delivers high testing accuracy and efficiency.
3. Each sensor features an independent anti-collision and overload protection system to prevent accuracy deviations caused by operational errors.
