WBE-9088B / Chip Shearing Push-pull Testing Machine

Chip Shearing Push-pull Testing Machine also known as a push-pull force tester (Bond Test), is a physical property testing instrument used in the field of mechanics. It is an important dynamic mechanical testing instrument for bonding processes, SMT processes, bonding processes, and microelectronics manufacturing. It is widely used in failure analysis and reliability testing of semiconductor packaging, optical communication device packaging, LED packaging, and military components.

Chip Shearing Push-pull Testing Machine is a high-precision, multi-functional chip push-pull force tester, widely used in chip testing, production process testing of overall integrated packaging technology, and product failure testing.

Application field:

Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.

Test standards:


Product features:

1. Capable of performing all tensile and shear applications, the comprehensive selection of hooks, load cutters, and jaws allows testing of a wide range of sample sizes and types.
2. Powerful and user-friendly dedicated software includes built-in CPK, MES, curve, and Excel spreadsheet data export capabilities.
3. All tests utilize VPM vertical traction and vertical positioning technology. Each sensor features an independent anti-collision and overload protection system to prevent accuracy loss due to operator error.
4. All-in-one test module with automatic rotation and module replacement, suitable for a variety of pulling, peeling, pushing, and shearing applications.