Shear Force Push-pull Testing Machine Widely used for failure analysis and reliability testing of semiconductor packaging, optical communication device packaging, LED packaging, and military components. It is an essential dynamic mechanical testing instrument for bonding, SMT, and microelectronics manufacturing.
Shear Force Push-pull Testing Machine also known as push-pull testing machines and wire bond strength testers, are essential dynamic mechanical testing instruments for bonding, SMT, bonding, and microelectronics manufacturing. They can perform all tensile and shear (push) applications, including wire bond strength pull testing (WP), solder joint push testing (BS), shear force testing (DS), down force testing (DP), pull-out testing (TP), and hot/cold ball pull (C/HBP).
Application field:
Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.
Test standards:
Product features:
1. Fully automatic module changer eliminates manual changes, ensuring accuracy while preventing damage to the machine caused by manual module replacement.
2. All-in-one automatic module changer allows selection of 1 to 6 modules (such as push, shear, tension, pullout, and downforce) individually or in combination.
3. Capable of performing all tension and shear (push) applications: wire bond strength pull (WP), solder joint push (BS), shear (DS), downforce (DP), pullout (TP), hot/cold ball pullout (C/HBP), and more.
4. Each sensor features an independent anti-collision and overload protection system to prevent accuracy deviations caused by operator error.
5. Customizable precision fixtures and test tools (consumables).
