Large stroke push-pull tester: widely used in microelectronics industry & semiconductor packaging for failure analysis and reliability testing. Such as wire welding strength test after microelectronic wire bonding, solder joint and substrate surface adhesion test, solder ball repetitive thrust fatigue test (inner lead pull test, micro solder joint thrust test, gold ball thrust test, chip shear force test, SMT welding component thrust test, BGA matrix overall thrust test).
Application field:
Widely used in semiconductor packaging, optical communication device packaging, LED packaging, military device products or materials for failure analysis and reliability testing.
Test standards:
See Chinese official website
Product features:
1.Can perform all tensile and shear (thrust) applications,
2. With bond wire strength tensile test (WP), solder joint thrust test (BS), solder chip shear test (DS), down force test (DP), pull-out force (TP), etc.,
3. All-in-one automatic rotation replacement module, you can select 1 to 6 modules such as (thrust, shear, tension, pull-out, down force) and other modules individually and in combination,
4. Each sensor uses an independent anti-collision overload protection system to prevent accuracy deviation due to operational errors.
5. Tailor-made various precision fixtures and test tools (consumables).
6. The X and Y axis travel can reach 500mm, and 650mm can be customized for special requirements to meet the testing of large-size samples.
7. Automatic rotation module change, automatically switch the corresponding module in 5 seconds according to the test needs, reduce the tediousness of manual module replacement, effectively reduce the risk of damage, high test accuracy and high efficiency,
8. Each sensor adopts an independent anti-collision overload protection system to prevent accuracy deviation due to operational errors.
