Custom Tooling for Your Push-Pull Testing Machine Application.

Custom Tooling for Your Push-Pull Testing Machine Application.

For semiconductor giants like SMIC and ASE GROUP, manufacturing yield is a primary driver of profitability. A WBE push-pull testing machine is a strategic asset in their continuous effort to maximize that yield. By providing fast, accurate, and repeatable data on bond quality, our machines act as an early warning system for the production line. When test data indicates a downward trend in bond strength, it allows process engineers to intervene immediately, long before the issue results in a large batch of rejected wafers or packaged devices. This real-time process control is invaluable. It helps our partners pinpoint issues with bonding equipment, diagnose material inconsistencies, or refine process parameters. By turning quality assurance into a proactive, data-driven process, the WBE push-pull testing machine helps these industry leaders reduce scrap, minimize rework, and maintain the highest possible yield, directly impacting their bottom line.

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From Dongguan to Worldwide, WBE ensures rapid response and localized support through its global service network.

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Certified calibration and strict compliance services guarantee the accuracy and integrity of every testing result.

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Comprehensive support ecosystem covering installation, operation guidance, and professional training to empower your team.

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Tailor-made testing chambers and systems designed to meet diverse industry standards and specific customer applications.

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Around-the-clock service commitment with prompt troubleshooting and maintenance to keep your equipment running reliably.

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Originated From

Guangdong WBE Instrument Technology Co., Ltd., abbreviated as WBE, was founded in 1995 and is headquartered in Dongguan, Guangdong Hong Kong Macao Greater Bay Area. It is a high-end testing instrument manufacturer. The company currently has over 12000 square meters of modern independent factories to meet various non-standard customized production needs, and has established five marketing service centers in Beijing, Chongqing, Xi'an, Suzhou, Dongguan and other places across the country, aiming to provide customers with more convenient and efficient services. Our products include various weather resistant environmental testing chambers, large-scale non-standard environmental testing chambers, chip packaging push-pull testing machines, and comprehensive mechanical and environmental non-standard testing machines.

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Key Specifications for a Wire Bond Pull Tester

When evaluating a push-pull testing machine specifically for wire bond pull testing, several key specifications are critical. Force accuracy, typically expressed as a percentage of the reading, is paramount; look for high accuracy even at the low end of the sensor's range. The Z-axis resolution and accuracy determine how precisely the machine can control the position of the pull hook, which is vital for repeatability. The range of pull hooks available is also important, as you will need different sizes and shapes to accommodate various wire diameters and loop heights. The magnification and lighting of the optical system are crucial for allowing the operator to precisely position the hook on fine wires. Finally, the machine's ability to record not just the peak force but also the JEDEC-standard failure mode is essential for effective process diagnostics when using a push-pull testing machine.

How to Select the Right Push-Pull Testing Machine

Selecting the right push-pull testing machine requires a careful evaluation of your specific applications. First, identify the types of tests you need (e.g., wire pull, die shear, ball shear). This will determine the required test modules or heads. Second, determine the force ranges needed for each test. A machine used for fine gold wire will need a very sensitive low-force sensor, while a machine for large die shear will need a high-force capability. Look for a system with interchangeable load cell cartridges for maximum flexibility. Third, consider the level of automation and the required throughput. Manual or motorized stages may be sufficient for a lab, while a fully automated system might be needed for high-volume production. Finally, evaluate the software capabilities, ensuring it can perform the necessary analysis and generate reports that meet your quality standards. Consulting with an expert at WBE can help you navigate these options to configure the perfect push-pull testing machine.

Calibration Requirements for High-Precision Bond Testers

Given the extremely small forces being measured, regular and proper calibration of a push-pull testing machine is absolutely essential for data integrity. Calibration is the process of comparing the machine's measurements to a known, traceable standard to ensure its accuracy. This should be performed on a regular schedule, typically annually, by a qualified technician. The process involves using a set of certified micro-weights to verify the accuracy of the load cell across its entire operating range. The positioning accuracy of the X, Y, and Z stages may also be verified using precision instruments. Without this regular verification, there is no guarantee that the force readings from the push-pull testing machine are correct, which can invalidate test results and compromise quality control. WBE offers accredited calibration services to ensure our clients' machines continuously operate at their peak specified accuracy.

The Difference Between Destructive and Non-Destructive Bond Testing

When using a push-pull testing machine, engineers can choose between two fundamental methods: destructive and non-destructive testing. Destructive testing is the most common method used for process control. It involves testing a sample of components to failure to determine the absolute maximum strength of the bonds. This provides valuable statistical data about the health and capability of the manufacturing process. Non-destructive testing, on the other hand, is used for 100% screening of very high-reliability devices, such as those used in military or space applications. In this test, the machine applies a proof force—a force that is significant but well below the expected breaking point—to every single wire bond. If a bond survives, it is certified as meeting a minimum strength requirement. WBE's push-pull testing machine can be precisely programmed to perform both types of tests accurately.

User Reviews

What users say about WBE

The high and low temperature test chamber runs with excellent stability and accurate control.

David Chen

We tested the thermal shock chamber, and it delivers consistent performance and durability.

Sophia Martinez

The push-pull and mechanical testing machines are precise, easy to operate, and reliable.

Michael Johnson

Their walk-in chambers and rapid temperature change units meet strict standards perfectly.

Emily Walker

The salt spray, rain, and aging test chambers provide reliable results and high protection.

James Anderson
Frequently Asked Question

Do you have any question?

The main tests performed by a push-pull testing machine include wire bond pull testing (to check the strength of wire-to-pad bonds), ball shear testing (to test the integrity of solder balls in BGA packages), die shear testing (to measure the adhesion strength of a semiconductor die to its substrate), and various other micro-force tests like tweezer pull or stud pull for specific components.

A push-pull testing machine is essential for semiconductors because it directly validates the reliability of the packaging process. A single faulty wire bond or a weak die attachment can cause a catastrophic failure of an entire integrated circuit. These machines provide the data needed for process control, quality assurance, and compliance with industry standards like MIL-STD-883.

A destructive pull test, the more common type, pulls a wire until it breaks to measure its ultimate bond strength. A non-destructive pull test, performed on a push-pull testing machine, applies a predetermined force (lower than the expected breaking strength) to 100% of the wires on a high-reliability device. This ensures all bonds meet a minimum strength requirement without destroying them.

The force range for a push-pull testing machine is typically very low, often from a few grams-force (gf) up to 100 kilograms-force (kgf). Different test heads and load cell cartridges are used to achieve high accuracy within specific ranges, such as 0-100 gf for fine wire pull testing or 0-100 kgf for die shear testing.

By providing immediate feedback on the quality of the bonding or soldering process, a push-pull testing machine helps engineers identify and correct process issues quickly. If bond strengths start to trend lower, it can indicate a problem with a wire bonder, a contaminated surface, or an incorrect parameter. Addressing these issues in real-time prevents the production of large quantities of faulty devices, thus improving overall yield.

Yes. WBE understands that modern electronics often involve unique package designs and components. We can develop custom tooling, workholders, and test routines for your specific push-pull testing machine application. Our engineering team works with clients to create tailored solutions for testing non-standard components and ensuring accurate, repeatable results.

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