Ensure MIL-STD-883 Compliance with Accurate Bond Testing.

Given the extremely small forces being measured, regular and proper calibration of a push-pull testing machine is absolutely essential for data integrity. Calibration is the process of comparing the machine's measurements to a known, traceable standard to ensure its accuracy. This should be performed on a regular schedule, typically annually, by a qualified technician. The process involves using a set of certified micro-weights to verify the accuracy of the load cell across its entire operating range. The positioning accuracy of the X, Y, and Z stages may also be verified using precision instruments. Without this regular verification, there is no guarantee that the force readings from the push-pull testing machine are correct, which can invalidate test results and compromise quality control. WBE offers accredited calibration services to ensure our clients' machines continuously operate at their peak specified accuracy.

As integrated circuit (IC) packaging evolves towards 3D-ICs, stacked dies, and System-in-Package (SiP) designs, the challenges for testing also increase. WBE's advanced push-pull testing machine solutions are engineered to meet these challenges. For stacked die applications, we offer specialized deep-access tooling to perform shear tests on the lower dies without interference. For fine-pitch and high-density wire bonding, our high-magnification optics and precise motion control allow for accurate testing of even the most challenging geometries. Our software is designed to handle complex test routines, allowing for different tests to be performed on a single device in one program. By continuously innovating and working with industry leaders, WBE ensures that our push-pull testing machine capabilities keep pace with the advancements in semiconductor technology, providing our clients with the tools they need to validate their most complex and valuable products.

The reliability of LEDs and other optoelectronic devices is heavily dependent on the mechanical and thermal integrity of their internal structure. A push-pull testing machine is a key tool for quality assurance in this industry. For high-power LEDs, the quality of the die attach is critical for effective heat dissipation; poor adhesion can cause the device to overheat and fail prematurely. Die shear testing is used to verify the strength and voiding of this thermal interface. Wire bonds in LEDs are also subject to stress from thermal cycling, so wire bond pull testing is essential to ensure they are robust. Furthermore, specialized tests like lens shear testing can be performed on a push-pull testing machine to ensure the optical element is securely attached to the package. By validating these critical assembly steps, manufacturers can ensure the long-term performance and reliability of their lighting and optoelectronic products.

Selecting the right push-pull testing machine requires a careful evaluation of your specific applications. First, identify the types of tests you need (e.g., wire pull, die shear, ball shear). This will determine the required test modules or heads. Second, determine the force ranges needed for each test. A machine used for fine gold wire will need a very sensitive low-force sensor, while a machine for large die shear will need a high-force capability. Look for a system with interchangeable load cell cartridges for maximum flexibility. Third, consider the level of automation and the required throughput. Manual or motorized stages may be sufficient for a lab, while a fully automated system might be needed for high-volume production. Finally, evaluate the software capabilities, ensuring it can perform the necessary analysis and generate reports that meet your quality standards. Consulting with an expert at WBE can help you navigate these options to configure the perfect push-pull testing machine.